Saturday, November 21, 2015

AW-1008 Plasma Asher Semiconductor Process Equipment


The AW-1008  single-wafer photoresist asher is an automated tool designed as a flexible downstream Microwave plasma photoresist removal system for high-volume wafer fabrication.  The AW-1008 is in direct response to manufacturer’s concerns for wafer sensitivity to processing RF damage, uptime, reliability and production-proven technology.


AW-1008 Applications:

l  Downstream ashing for NO device damage
l  Frontside and backside isotropic removal
l  Bulk resist removal
l  Single wafer process
l  High-dose implanted resist
l  Non-oxidizing metal processing
l  Descum  

AW-1008 Key Features:

l  Production-proven plasma stripper/Asher system technology.
l  5-15% Uniformity. (Process & Hardware dependent.  Optional.)
l  Fast strip/ash rate. (Process & Hardware dependent.  Optional.)
l  Increased throughput with 3-Axis Integrated Robust Solid Robot.
l  Frontside and backside isotropic removal.
l  3x 1kW IR Lamp for uniform heating up to 500C.
l  75mm-150mm wafer capability.
l  Endpoint detection w/Allwin21 SLOPE technology (Optional)
l  2 wafer sizes capability without hardware change if necessary.
l  Two Fixed cassette stations.  Or, one Fixed & one centering station.
l  Can handle 50um thickness wafer
l  PC controller with Advanced Allwin21 Software Package
l  Up to 4 gas lines with MFC’s
l  2.45GHz 1000W Microwave
l  Pressure control with Throttle Valve
l  Touch screen monitor
l  EMO, Interlocks, and Watchdog function
l  GEM/SECS II interface, Optional
l  Small Footprint
l  Made in U.S.A.

AW-1008 Software Key Features:

l  Real time graphics display, process data acquisition, and analysis.
l  Closed-loop process parameters control.
l  Precise parameters profiles tailored to suit specific process requirements.
l  Programmable comprehensive calibration of all subsystems from within the software.  This allows faster, easier calibration, leading to enhanced process results.
l  Recipe creation.  It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the process chamber.
l  Validation of the recipe so improper control sequences will be revealed.
l  Storage of multiple recipes, process data and calibration files so that process and calibration results can be maintained and compared over time.
l  Passwords provide security for the system, recipe editing, diagnostics, calibration and setup functions
l  Simple and easy to use menu screen which allow a process cycle to be easily defined and executed.
l  Troubleshooting features which allows engineers and service personnel to activate individual subassemblies and functions. More I/O, AD/DA “exposure”.
l  DB-25F parallel (printer) port.  The computer interfaces to the Allwin21 system with only one cable: the control interface cable.
l  The control board inside the machine that translates the computer commands to control the machine has a watchdog timer.  If this board looses communication with the control software, it will shut down all processes and halt the system until communication is restored.
l  GEM/SECS II function (Optional).
l  Advanced Allwin21 EOP function (Optional)
.

l  Wafer Size: 3 ,4,5,6 inch Capability. Multiple wafer size without hardware charge.
l  Temperature: 150-350 ºC (±2 ºC) capability
l  Gas Lines: Up to four gas lines with MFCs. Popular MFC Range: 510 SLM O2 and 1 SLM  N2.
l  Asher Rate: 1.5u-5u/min. positive photoresist; >8u/min. negative photoresist
l  Uniformity: 15%,  Process Dependent
l  Particulate: <0.05 /cm2 (0.03um or greater)
l  Damage: CV: <0.I V CV-shift for 250A gate oxide
l  Selectivity: >1000:1
l  MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better. 95% uptime
l  *Contact Allwin21 sales for other applications and specifications

AW-1008 Configuration:

l  Main Frame with Breakers, Relays and Wires
l  Pentium Class PC with AW Software
l  Keyboard, Mouse, USB with SW backup and Cables
l  Quartz Tray
n  3-4 inch;  4-6 inch; 5 inch; 6 inch; Others
l  Fixed Cassette Station
n  Two Cassette Stations;    One Cassette Station
l  Lamp Heat Module and Quartz Window (3 of 1000W IR lamp)
l  6 inch Quartz showerhead and 5 inch Diffusion Disk
l  Chamber Top Plate and Body with TC for Close Loop Temperature Control (CLTC)
l  Main Control, Distributor PCB and DC
l  H1-7X10.5 Integrated Solid Robot
l  Waveguide and Quartz Plasma Tube
l  Blower for Magnetron and Waveguide
l  Capacitor, Two Transformers, HV Diode
l  1000W Air cooling magnetron
l  1-4 Gas Lines w/ Pneumatic Valve, and MFC
n  One MFC; Two MFCs; Three MFCs; Four MFCs
l  AC Box and Lamp Control PCB for Close Loop Temperature Control (CLTC)
l  Main Vacuum Valves. Two, one for  Fast and one for slow pump down
l  MKS Baratron
l  Throttle Valve
l  Front EMO, Interlocks
l  15-inch Touch Screen GUI

AW-1008 Options:

l  EOP Module with PCB
l  GEM/SECS II function (Software)
l  Lamp Tower Alarm  function
l  1.25kW “Absolute” MW Magnetron with water-cooled Waveguide with AGL Power Generator.

l  Vacuum Pump

Keywords:Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Gasonics Aura 1000, Gasonics Aura 2000, Gasonics Aura 3000, Gasonics L3510, Gasonics Aura 3010

AW-B3000 Barrel Plasma Asher Plasma Descum Equipment


The AW-B3000 batch/barrel photoresist asher is a manual load tool designed as a flexible 13.56 MHz RF plasma photoresist removal system for high-volume wafer fabrication. The AW-B3000 is in direct response to manufacturer’s concerns for Uptime, Reliability, Production-Proven technology. and low cost of ownership.


AW-B3000 Applications:

*        Low cost production-proven plasma Asher / Descum
*        Front and backside isotropic photoresist removal.
*        Barrel/Batch Manual Load Process
*        Descum

AW-B3000 Key Features:

*        Production-proven plasma Stripper/Asher/Descum technology.
*        Up to 25% Uniformity. Much lower if used with a Faraday Cage.
*        Consistent wafer-to-wafer uniformity.
*        TC Option can be used with an N2 Plasma to heat the wafers up to 170°C (Chamber) to increase ash rate.
*        End-of-Process (EOP) Option automatically stops the Process after all wafers are fully stripped regardless of wafer quantity or photoresist thickness.
*        Samples, 6” square, and up to 8” round wafers capable.
*        Many wafer sizes capability without hardware change.
*        Can handle different thickness wafer with different carriers.
*        New controller with PC with Advanced AW Software
*        Up to 5 isolated gas lines with MFC’s
*        13.56 MHz RF Generator.  (Air-cooled Optional)
*        Pressure Control Throttle Valve for better process repeatability.  (Optional)
*        MKS Baratron (Optional)
*        Touch screen GUI
*        EMO, Interlocks and Watchdog function
*        GEM/SECS II (Optional)
*        Made in U.S.A.

AW-B3000 Software Key Features:

*        Real time graphics display (GUI), process data acquisition, display, and analysis.
*        Closed-loop process parameters control.
*        Precise parameters profiles tailored to suit specific process requirements. 
*        Programmable comprehensive calibration of all subsystems from within the software.  This allows faster, easier calibration, leading to enhanced process results.
*        Recipe creation. It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the process chamber.
*        Validation of the recipe so improper control sequences will be revealed.
*        Storage of multiple recipes, process data and calibration files so that process and calibration results can be maintained and compared over time.
*        Passwords provide security for the system, recipe editing, diagnostics, calibration and setup functions
*        Simple and easy to use menu screen which allow a process cycle to be easily defined and executed.
*        Troubleshooting features which allows engineers and service personnel to activate individual subassemblies and functions. More I/O, AD/DA “exposure”.
*        DB-25F parallel (printer) port.  The computer interfaces to the Allwin21 system with only one cable: the control interface cable.
*        The control board inside the machine that translates the computer commands to control the machine has a watchdog timer.  If this board looses communication with the control software, it will shut down all processes and halt the system until communication is restored.
*        GEM/SEC II function (Optional).
*        Advanced Allwin21 EOP function (Optional)
.
AW-B3000 Specifications:

*        Wafer Size: Sample to 200mm Capability.  Multiple wafer size without hardware change
*        High Throughput: Up to 75 WPH. Process Dependent.
*        Temperature: Only TC Option can be used for N2 plasma to heat the substrates up to 170°C.
*        Gas Lines: Up to 5 isolated gas lines with MFCs.
*        Asher Rate: 0-0.1u/min. positive PR; >0.2u/min. negative PR.  Slower if Faraday Cage is used
*        Uniformity: Up to 25%. Much lower with Faraday Cage.
*        Particulate: <0.05 /cm2 (0.03um or greater)
*        Damage: Low damage with Faraday Cage.
*        Selectivity: >1000:1
*        MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better.
*        95% uptime
*        Contact Allwin21 sales for other applications and specifications

AW-B3000 Configuration:

*        Main Body with wires
*        Control Box
*        Pentium Class PC with AW Software
*        Keyboard, Mouse, USB with SW backup and Cables
*        Main Control PCB and DC
*        Transformer, Circuit Breaker,Contactor
*        1-5 Isolated Gas Lines w/ Pneumatic Valve and MFC
*        Purge has manual regulator in controller box to control speed.
*        Quartz Chamber: Dia 12” x Depth 23”;
*        RF Match Network Integrated in the Main Body of tool.
*        Chamber Door with quartz plate in the Main Body.
*        Gas and vacuum lines Connections in the Main Body
*        13.56MHz RF Generator (Air-Cooled is Optional)
n  300W;  600W;  1000W;  1200W
*        Lamp tower alarm with buzzer
*        Main Vacuum Valve
*        MKS Baratron
*        Throttle Valve
*        Front EMO, Interlocks
*        15-inch Touch Screen GUI

AW-B3000 Options:

*        End-of-Process (EOP) function.
*        Throttle Valve for pressure control.
*        Air-cooled RF Generator.
*        GEM/SECS II function (Software)
*        Thermocouple for Chamber Temperature

*        Vacuum Pump

Keywords:Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Branson/IPC 2000, Branson/IPC 3000, Branson/IPC 4000, Barrel Asher, Barrel Etch, Barrel Etcher