Saturday, November 21, 2015

AW-1008 Plasma Asher Semiconductor Process Equipment


The AW-1008  single-wafer photoresist asher is an automated tool designed as a flexible downstream Microwave plasma photoresist removal system for high-volume wafer fabrication.  The AW-1008 is in direct response to manufacturer’s concerns for wafer sensitivity to processing RF damage, uptime, reliability and production-proven technology.


AW-1008 Applications:

l  Downstream ashing for NO device damage
l  Frontside and backside isotropic removal
l  Bulk resist removal
l  Single wafer process
l  High-dose implanted resist
l  Non-oxidizing metal processing
l  Descum  

AW-1008 Key Features:

l  Production-proven plasma stripper/Asher system technology.
l  5-15% Uniformity. (Process & Hardware dependent.  Optional.)
l  Fast strip/ash rate. (Process & Hardware dependent.  Optional.)
l  Increased throughput with 3-Axis Integrated Robust Solid Robot.
l  Frontside and backside isotropic removal.
l  3x 1kW IR Lamp for uniform heating up to 500C.
l  75mm-150mm wafer capability.
l  Endpoint detection w/Allwin21 SLOPE technology (Optional)
l  2 wafer sizes capability without hardware change if necessary.
l  Two Fixed cassette stations.  Or, one Fixed & one centering station.
l  Can handle 50um thickness wafer
l  PC controller with Advanced Allwin21 Software Package
l  Up to 4 gas lines with MFC’s
l  2.45GHz 1000W Microwave
l  Pressure control with Throttle Valve
l  Touch screen monitor
l  EMO, Interlocks, and Watchdog function
l  GEM/SECS II interface, Optional
l  Small Footprint
l  Made in U.S.A.

AW-1008 Software Key Features:

l  Real time graphics display, process data acquisition, and analysis.
l  Closed-loop process parameters control.
l  Precise parameters profiles tailored to suit specific process requirements.
l  Programmable comprehensive calibration of all subsystems from within the software.  This allows faster, easier calibration, leading to enhanced process results.
l  Recipe creation.  It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the process chamber.
l  Validation of the recipe so improper control sequences will be revealed.
l  Storage of multiple recipes, process data and calibration files so that process and calibration results can be maintained and compared over time.
l  Passwords provide security for the system, recipe editing, diagnostics, calibration and setup functions
l  Simple and easy to use menu screen which allow a process cycle to be easily defined and executed.
l  Troubleshooting features which allows engineers and service personnel to activate individual subassemblies and functions. More I/O, AD/DA “exposure”.
l  DB-25F parallel (printer) port.  The computer interfaces to the Allwin21 system with only one cable: the control interface cable.
l  The control board inside the machine that translates the computer commands to control the machine has a watchdog timer.  If this board looses communication with the control software, it will shut down all processes and halt the system until communication is restored.
l  GEM/SECS II function (Optional).
l  Advanced Allwin21 EOP function (Optional)
.

l  Wafer Size: 3 ,4,5,6 inch Capability. Multiple wafer size without hardware charge.
l  Temperature: 150-350 ºC (±2 ºC) capability
l  Gas Lines: Up to four gas lines with MFCs. Popular MFC Range: 510 SLM O2 and 1 SLM  N2.
l  Asher Rate: 1.5u-5u/min. positive photoresist; >8u/min. negative photoresist
l  Uniformity: 15%,  Process Dependent
l  Particulate: <0.05 /cm2 (0.03um or greater)
l  Damage: CV: <0.I V CV-shift for 250A gate oxide
l  Selectivity: >1000:1
l  MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better. 95% uptime
l  *Contact Allwin21 sales for other applications and specifications

AW-1008 Configuration:

l  Main Frame with Breakers, Relays and Wires
l  Pentium Class PC with AW Software
l  Keyboard, Mouse, USB with SW backup and Cables
l  Quartz Tray
n  3-4 inch;  4-6 inch; 5 inch; 6 inch; Others
l  Fixed Cassette Station
n  Two Cassette Stations;    One Cassette Station
l  Lamp Heat Module and Quartz Window (3 of 1000W IR lamp)
l  6 inch Quartz showerhead and 5 inch Diffusion Disk
l  Chamber Top Plate and Body with TC for Close Loop Temperature Control (CLTC)
l  Main Control, Distributor PCB and DC
l  H1-7X10.5 Integrated Solid Robot
l  Waveguide and Quartz Plasma Tube
l  Blower for Magnetron and Waveguide
l  Capacitor, Two Transformers, HV Diode
l  1000W Air cooling magnetron
l  1-4 Gas Lines w/ Pneumatic Valve, and MFC
n  One MFC; Two MFCs; Three MFCs; Four MFCs
l  AC Box and Lamp Control PCB for Close Loop Temperature Control (CLTC)
l  Main Vacuum Valves. Two, one for  Fast and one for slow pump down
l  MKS Baratron
l  Throttle Valve
l  Front EMO, Interlocks
l  15-inch Touch Screen GUI

AW-1008 Options:

l  EOP Module with PCB
l  GEM/SECS II function (Software)
l  Lamp Tower Alarm  function
l  1.25kW “Absolute” MW Magnetron with water-cooled Waveguide with AGL Power Generator.

l  Vacuum Pump

Keywords:Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Gasonics Aura 1000, Gasonics Aura 2000, Gasonics Aura 3000, Gasonics L3510, Gasonics Aura 3010

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