The AW-B3000 batch/barrel
photoresist asher is a manual load tool designed as a flexible 13.56 MHz RF
plasma photoresist removal system for high-volume wafer fabrication. The AW-B3000 is in direct response to
manufacturer’s concerns for Uptime, Reliability, Production-Proven technology.
and low cost of ownership.
Low cost production-proven
plasma Asher / Descum
Front and backside isotropic
photoresist removal.
Barrel/Batch Manual Load
Process
Descum
Production-proven plasma
Stripper/Asher/Descum technology.
Up to 25% Uniformity. Much
lower if used with a Faraday Cage.
Consistent wafer-to-wafer
uniformity.
TC Option can be used with
an N2 Plasma to heat the wafers up to 170°C (Chamber) to increase ash rate.
End-of-Process (EOP) Option
automatically stops the Process after all wafers are fully stripped regardless
of wafer quantity or photoresist thickness.
Samples, 6” square, and up
to 8” round wafers capable.
Many wafer sizes capability
without hardware change.
Can handle different
thickness wafer with different carriers.
New controller with PC with
Advanced AW Software
Up to 5 isolated gas lines
with MFC’s
13.56 MHz RF Generator. (Air-cooled Optional)
Pressure Control Throttle
Valve for better process repeatability.
(Optional)
MKS Baratron (Optional)
Touch screen GUI
EMO, Interlocks and Watchdog
function
GEM/SECS II (Optional)
Made in U.S.A.
Real time graphics display
(GUI), process data acquisition, display, and analysis.
Closed-loop process
parameters control.
Precise parameters profiles
tailored to suit specific process requirements.
Programmable comprehensive
calibration of all subsystems from within the software. This allows faster, easier calibration,
leading to enhanced process results.
Recipe creation. It features
a recipe editor to create and edit recipes to fully automate the processing of
wafers inside the process chamber.
Validation of the recipe so
improper control sequences will be revealed.
Storage of multiple recipes,
process data and calibration files so that process and calibration results can
be maintained and compared over time.
Passwords provide security
for the system, recipe editing, diagnostics, calibration and setup functions
Simple and easy to use menu
screen which allow a process cycle to be easily defined and executed.
Troubleshooting features
which allows engineers and service personnel to activate individual
subassemblies and functions. More I/O, AD/DA “exposure”.
DB-25F parallel (printer)
port. The computer interfaces to the
Allwin21 system with only one cable: the control interface cable.
The control board inside the
machine that translates the computer commands to control the machine has a
watchdog timer. If this board looses
communication with the control software, it will shut down all processes and
halt the system until communication is restored.
GEM/SEC II function (Optional).
Advanced Allwin21 EOP
function (Optional)
.
Wafer Size: Sample to 200mm
Capability. Multiple wafer size without
hardware change
High Throughput: Up to 75
WPH. Process Dependent.
Temperature: Only TC Option
can be used for N2 plasma to heat the substrates up to 170°C.
Gas Lines: Up
to 5 isolated gas lines with MFCs.
Asher Rate: 0-0.1u/min.
positive PR; >0.2u/min. negative PR.
Slower if Faraday Cage is used
Uniformity: Up to 25%. Much
lower with Faraday Cage.
Particulate: <0.05 /cm2
(0.03um or greater)
Damage: Low damage with
Faraday Cage.
Selectivity: >1000:1
MTBF/MTTA/MTTR: 450
Hours/100 Hours/3.5 Hours or Better.
95% uptime
Contact Allwin21 sales for
other applications and specifications
Main Body with wires
Control Box
Pentium Class PC with AW
Software
Keyboard, Mouse, USB with SW
backup and Cables
Main Control PCB and DC
Transformer, Circuit
Breaker,Contactor
1-5 Isolated Gas Lines w/
Pneumatic Valve and MFC
Purge has manual regulator
in controller box to control speed.
Quartz Chamber: Dia
12” x Depth 23”;
RF Match Network Integrated
in the Main Body of tool.
Chamber Door with quartz
plate in the Main Body.
Gas and vacuum lines
Connections in the Main Body
13.56MHz RF Generator
(Air-Cooled is Optional)
n ① 300W; ② 600W; ③ 1000W; ④ 1200W
Lamp tower alarm with buzzer
Main Vacuum Valve
MKS Baratron
Throttle Valve
Front EMO, Interlocks
15-inch Touch Screen GUI
End-of-Process (EOP)
function.
Throttle Valve for pressure
control.
Air-cooled RF Generator.
GEM/SECS II function
(Software)
Thermocouple for Chamber
Temperature
Vacuum Pump
Keywords:Plasma Asher, Plasma Descum, Dry Clean,
Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process
Equipment, Branson/IPC 2000, Branson/IPC 3000, Branson/IPC 4000, Barrel Asher,
Barrel Etch, Barrel Etcher
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