Saturday, November 21, 2015

AW-105R Plasma Asher Plasma Descum Semiconductor Process Equipment


The AW-105R single-wafer photoresist asher and descum is an automated tool designed as a flexible 13.56MHz RF Parallel Plate plasma photoresist removal and descum system for high-volume wafer fabrication. The AW-105R is in direct response to manufacturer’s concerns for wafer uniformity, uptime, reliability and production-proven technology.


AW-105R Applications:

*        GaAs, InP, GaN, SiC wafer Strip (Mainly)
*        GaAs, InP, GaN, SiC wafer Descum (Mainly)
*        Thin Film Head Resist Cleaning
*        Opto-Electronic Devices Cleaning
*        MEMS
*        Photoresist Stripping
*        High dose implant (As+, B+, P+)           
*        Rework
*        Post-polysilicon 
*        Post-metal
*        Post-oxide
*        Controlled Resist Removal
*        Post-develop descum
*        Uniformity capability (<5% 1σ)

AW-105R Key Features:

*        Production-proven plasma Asher/Descum system.
*        Integrated solid robotic wafer handling, Single wafer process.
*        Up to 3%-5% Uniformity. Best for III-V Materials.
*        Frontside and backside isotropic removal.
*        Consistent wafer-to-wafer process cycle repeatability.
*        Element heating for up to 250oC.
*        50mm-150mm wafer capability. Up to 6.25” substrate.
*        Up to 4 wafer size capability without hardware change.
*        Fixed cassette station and wafer aligner/cooling station.
*        Can handle 50um thickness wafer.
*        PC controller with Advanced Allwin21 Software.
*        Endpoint detection (EOP) with Allwin21 SLOPE technology (Optional).
*        Up to 3 gas lines with MFC.
*        Air-Cooled 600W MKS 13.56 MHz RF Generator (300W Option).
*        Pressure control with Throttle Valve.
*        15-inch Touch screen monitor GUI.
*        EMO, Interlocks, and Watchdog function.
*        GEM/SECS II (optional).
*        Small Footprint: 27”W x 40”D x 59”H   (280LBs)
*        Made in U.S.A.

AW-105R Software Key Features:

*        Real time graphics display, process data acquisition, and analysis.
*        Closed-loop process parameters control.
*        Precise parameters profiles tailored to suit specific process requirements.
*        Programmable comprehensive calibration of all subsystems from within the software. This allows faster, easier calibration, leading to enhanced process results.
*        Recipe creation to ensure process repeatability. It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the process chamber.
*        Validation of the recipe so improper control sequences will be revealed.
*        Storage of multiple recipes, process data, and calibration files so that process & calibration results can be maintained or compared over time.
*        Passwords provide security for the system, recipe editing, diagnostics, calibration, and setup functions.
*        Simple and easy to use menu screen which allow a process cycle to be easily defined and executed.
*        Troubleshooting features which allows engineers and service personnel to activate individual subassemblies and functions. More I/O and AD/DA “exposure”.
*        DB-25F parallel (printer) port.  The computer interfaces to the Allwin21 system with only one cable: the control interface cable.
*        The control board inside the machine that translates the computer commands to control the machine has a watchdog timer. If this board loses communication with the control software, it will shut down all processes and halt the system until communication is restored.
*        GEM/SECS II function (Optional).
*        Advanced Allwin21 End of Process (EOP) function (Optional).

AW-105R Specifications:

*        Wafer Size: Up to 6.25 inch.
*        Temperature: 60-250ºC (±2ºC)
*        Gas Lines: Up to three gas lines with MFCs.
n  Typical MFC configuration: 5 SLM O2 and 500 SCCM N2.
*        Asher Rate: 0.5-1.5 um/min at 200 to 250 ºC, bulk strip; 600 A/min at 100 ºC, Descum
*        Uniformity: <±8% (Max-Min) Strip; <±5% (Max-Min) Descum
*        Particulate: <0.05 /cm2 (0.03um or greater)
*        Damage: CV:<0.1V from control; Mobile Ion:<1-2 E10 ; Vt :0% total shift on 98% of points tested no shift >5%
*        Selectivity: >1000:1
*        MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better.
*        95% uptime
*        *Contact Allwin21 sales for other applications and specifications

AW-105R Configuration:

*        Main Frame with Circuit Breakers, Solenoid Valves
*        Pentium Class PC with AW Software
*        Keyboard, Mouse, USB SW backup, and Cables
*        Chuck /w Heat, Pump Ring ,Lift Pins
n  2-4 inch;  2-6 inch; 4-6 inch; 6.125 inch; 6.25 inch
*        Center Aligner and Cassette Station
n  Two Dimensions    Four Dimensions
*        Anodized Reactor with Door
*        Chamber Base plate with water sensor
*        Base Plate and Reactor Ceramic Ring
*        Base Plate and Chuck Ceramic Ring
*        Upper and Lower Electrodes
*        Quartz showerhead & Diffusion Disk
*        Main Control and Distribution PCBs
*        3-axis Integrated Robust Solid Robot
*        RF Matching Network with PCBs
*        13.56MHz RF Generator
n  300W     600W
*        MFC /w In-line Filter and Solenoid Isolation Valve
n  One MFC;  Two MFCs;  Three MFCs
*        AC/DC Box with Temperature Controller
*        MKS Baratron with Isolation Valve
*        Lamp Tower Alarm w/ Buzzer
*        Throttle Valve
*        Main Vacuum Valve
*        Front EMO, Interlocks
*        15-inch Touch Screen GUI

AW-105R Options:

*        End-of-Process (EOP)
*        GEM/SECS II (Software)
*        Vacuum Pump

*        Chiller for Chamber Base Plate

Keywoeds:Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Matrix 105, Matrix 205, Matrix 303, Matrix 403,Matrix 106,Matrix 104, Matrix 102,Matrix 101, Matrix 10

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