The AW-105R single-wafer photoresist asher and descum is an automated tool designed as a
flexible 13.56MHz RF Parallel Plate plasma photoresist removal and descum
system for high-volume wafer fabrication. The AW-105R is in direct response to
manufacturer’s concerns for wafer uniformity, uptime, reliability and
production-proven technology.
GaAs, InP, GaN, SiC wafer
Strip (Mainly)
GaAs, InP, GaN, SiC wafer
Descum (Mainly)
Thin Film Head Resist
Cleaning
Opto-Electronic Devices
Cleaning
MEMS
Photoresist
Stripping
High dose implant (As+,
B+, P+)
Rework
Post-polysilicon
Post-metal
Post-oxide
Controlled
Resist Removal
Post-develop descum
Uniformity capability
(<5% 1σ)
Production-proven plasma
Asher/Descum system.
Integrated solid robotic
wafer handling, Single wafer process.
Up to 3%-5% Uniformity. Best
for III-V Materials.
Frontside and backside
isotropic removal.
Consistent wafer-to-wafer
process cycle repeatability.
Element heating for up to
250oC.
50mm-150mm wafer capability.
Up to 6.25” substrate.
Up to 4 wafer size
capability without hardware change.
Fixed cassette station and
wafer aligner/cooling station.
Can handle 50um thickness
wafer.
PC controller with Advanced
Allwin21 Software.
Endpoint detection (EOP)
with Allwin21 SLOPE technology (Optional).
Up to 3 gas lines with MFC.
Air-Cooled 600W MKS 13.56
MHz RF Generator (300W Option).
Pressure control with Throttle
Valve.
15-inch Touch screen monitor
GUI.
EMO, Interlocks, and
Watchdog function.
GEM/SECS II (optional).
Small Footprint: 27”W x 40”D
x 59”H (280LBs)
Made in U.S.A.
Real time graphics display,
process data acquisition, and analysis.
Closed-loop process
parameters control.
Precise parameters profiles
tailored to suit specific process requirements.
Programmable comprehensive
calibration of all subsystems from within the software. This allows faster,
easier calibration, leading to enhanced process results.
Recipe creation to ensure
process repeatability. It features a recipe editor to create and edit recipes
to fully automate the processing of wafers inside the process chamber.
Validation of the recipe so
improper control sequences will be revealed.
Storage of multiple recipes,
process data, and calibration files so that process & calibration results
can be maintained or compared over time.
Passwords provide security
for the system, recipe editing, diagnostics, calibration, and setup functions.
Simple and easy to use menu
screen which allow a process cycle to be easily defined and executed.
Troubleshooting features
which allows engineers and service personnel to activate individual
subassemblies and functions. More I/O and AD/DA “exposure”.
DB-25F parallel (printer)
port. The computer interfaces to the
Allwin21 system with only one cable: the control interface cable.
The control board inside the
machine that translates the computer commands to control the machine has a watchdog
timer. If this board loses communication with the control software, it will
shut down all processes and halt the system until communication is restored.
GEM/SECS II function
(Optional).
Advanced Allwin21 End of
Process (EOP) function (Optional).
Wafer Size: Up to 6.25 inch.
Temperature: 60-250ºC (±2ºC)
Gas Lines: Up to three gas
lines with MFCs.
n Typical
MFC configuration: 5 SLM O2 and 500 SCCM N2.
Asher Rate: 0.5-1.5 um/min
at 200 to 250 ºC, bulk strip; 600 A/min at 100 ºC, Descum
Uniformity: <±8%
(Max-Min) Strip; <±5% (Max-Min) Descum
Particulate: <0.05 /cm2
(0.03um or greater)
Damage: CV:<0.1V from
control; Mobile Ion:<1-2 E10 ; Vt :0% total shift on 98% of points tested no
shift >5%
Selectivity: >1000:1
MTBF/MTTA/MTTR: 450
Hours/100 Hours/3.5 Hours or Better.
95% uptime
*Contact Allwin21 sales for
other applications and specifications
Main Frame with Circuit
Breakers, Solenoid Valves
Pentium Class PC with AW
Software
Keyboard, Mouse, USB SW
backup, and Cables
Chuck /w Heat, Pump Ring
,Lift Pins
n ① 2-4 inch; ②
2-6 inch; ③ 4-6 inch; ④
6.125 inch; ⑤ 6.25 inch
Center Aligner and Cassette
Station
n ① Two Dimensions ②
Four Dimensions
Anodized Reactor with Door
Chamber Base plate with
water sensor
Base Plate and Reactor
Ceramic Ring
Base Plate and Chuck Ceramic
Ring
Upper and Lower Electrodes
Quartz showerhead &
Diffusion Disk
Main Control and
Distribution PCBs
3-axis Integrated Robust
Solid Robot
RF Matching Network with
PCBs
13.56MHz RF Generator
n ① 300W ②
600W
MFC /w In-line Filter and
Solenoid Isolation Valve
n ① One MFC; ②
Two MFCs; ③
Three MFCs
AC/DC Box with Temperature
Controller
MKS Baratron with Isolation
Valve
Lamp Tower Alarm w/ Buzzer
Throttle Valve
Main Vacuum Valve
Front EMO, Interlocks
15-inch Touch Screen GUI
End-of-Process (EOP)
GEM/SECS II (Software)
Vacuum Pump
Chiller for Chamber Base
Plate